Silicon Box raises $155M Series B

Figures for the round differ by source. Silicon Box says it closed an extension of its Series B at USD 156.5 million and raised a USD 75 million debt facility, putting its valuation above USD 1.7 billion. Tracxn lists a $150M round on May 5, 2026, with EDBI as an investor, plus about $77.6M in debt from Innoven Capital, January Capital, Abound Capital and Ares Management. PitchBook tags the equity deal as a Series B3 dated April 29, 2026.

The original Series B was $200M, announced in January 2024 at a valuation above $1 billion. Backers included BRV Capital, Hillhouse, Lam Capital, Maverick Capital, Tata Electronics, TDK Ventures and UMC Capital. Revenue is still early: the company reported $1.87 million in 2024, its first year of production at the Singapore factory. It makes chiplet packages on large panels rather than wafers, and says it can cut manufacturing costs for high-performance devices by up to 90%.

For AI builders, advanced packaging is a constraint on accelerator supply. A funded panel-level alternative could widen sourcing options for custom silicon teams. The revenue base is still small, so capacity and yields at scale are unproven.