Broadcom and Blackstone assemble $60B in debt to finance Anthropic's TPU chip buildout

Broadcom is raising a $60 billion debt package to fund AI chips and infrastructure for Anthropic, Bloomberg reported October 2: a $42 billion senior-secured Class A tranche being syndicated by banks and an $18 billion junior Class B tranche led by Blackstone, which is putting in $9 billion of its own capital. The structure follows a filing showing Broadcom will lend Anthropic up to $42 billion in convertible notes tied to chip leases, covering about a third of Anthropic's $125.2 billion five-year TPU lease commitment, with 3.5 GW of capacity due in 2027. Anthropic's prospectus flags the conflict of Broadcom acting as both vendor and lender. Vendor-arranged private credit is now the dominant way frontier compute gets paid for.