Kandou AI raises $225M Series A

Kandou AI specializes in the design of high-speed, and pin- and energy-efficient chip-to-chip links, SerDes, and associated technologies. The company announced a $225M Series A on March 23, 2026, from its base in Lausanne, CH. Investors and valuation were not disclosed in Crunchbase's round record; Lounge adds them as they are reported. It has raised more than $100M in total venture funding.